CAPABILITIES

Trelec has three surface mounting lines. This gives us flexibility in the production process and lets us adapt to the needs of each client.

Our automated optical inspection equipment ensures high speed and exceptional quality in defect detection. Our machines allow us to verify that all components are present and to inspect solder paste deposition and the polarity and value of components.

Our X-ray inspection equipment allows us to visually inspect the interior of ball grid arrays (BGAs) and quad flat packs (QFPs) and to focus on the soldering of the balls and the underside of the BGA package.

In our bid to ensure quality, we carry out in-circuit tests (ICT) and other testing that may be required by the client's process. In an in-circuit test, an electrical probe tests populated circuit boards, checking for shorts, opens, resistances and other basic values, and determining whether the boards have been correctly assembled.

At Trelec, we do rework following client specifications. Reworking can involve anything from making changes to the hardware version to making changes to BGAs, micro BGAs, FPGAs (fine-pitch ball grid arrays), QFPs and fine pitch QFPs, among other components. Rework with BGAs, QFPs and the like is done using a Finetech machine specialized in making changes to these components.

We support industrial engineering divisions, R&D departments and product development projects in the fabrication of electronic products from the design stage onwards, increasing competitiveness in terms of delivery and price. We also advise in the selection and purchase of components, keeping in mind obsolescence, turnover and average component delivery times.