Trelec. Bilbao Technology Center
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Capabilities
Surface Mount Equipment. SME
Selective Solder Machine
Through-Hole technology
Automated Optical Inspection
BGA X-Ray inspection
Testing
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X-Ray Laminography
Vibration Testing
Turnkey
Three-Dimensional Laser Paste
Tape Automated Bonding
System Design and Engineering
Synchronous Dynamic Random Access Memory (SDRAM)
Surface Mount Technology (SMT)
Supply Chain Management (SCM)
Static Random Access Memory (SRAM)
Small-Outline J-lead (SOJ)
Semiconductors
Scanning Electron Microscopy
Prototyping
Product Assurance
Product Assembly And Test
Printed Circuit Board (PCB)
Pin-Through-Hole (PTH)
New Product Introduction (NPI)
New Product Design
Multichip Module Laminates
Microvias
Microprocessors
Laser Direct Imaging
Interconnect
Integrated Circuits (IC)
In-Situ Dynamic Thermal Cycling Stress Testing
In-Circuit Testing
Functional Testing
Full System Build,
Flip Chips
Flex Circuit Assembly
Flash
Environmental Stress Screening
Enclosures
Dynamic Random Access Memory (DRAM)
Direct Order Fulfillment
Digital Signal Processors (DSP)
Design For Manufacturability (DFM)
Chip Scale Packaging
Chip-On-Board (COB)
Capacitors
Cache
BUS
Burn-In Testing
Build To Order (BTO)
Blind or Buried Vias
Backplanes or Backpanels
Approved Vendor List (AVL)
Application-Specific Integrated Circuits (ASIC)
Annular Rings
After Sales Support
Advanced Substrates
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