Trelec. Bilbao Technology Center

While we keep our philosophy for quality and excellence, Trelec has dedicated an entire area to BGA inspection, X-Ray, and Rework.  Our BGA X-Ray and inspection equipment allows us to gain visual access under BGAs (Ball Grid Arrays) and QFPs (Quad Flat Packs) .The ERSA technology allows us to focus on and see the interior ball contacts in the middle of a BGA package view the toe and heel of a QFP with ease.

Our FEIN FOCUS allows us to verify quality. We detect the failures in soldering, vacuums of air bubbles, avoiding performance failures not only in the test phase but also on further levels of production. We can generate specific profiles for every component changing the BGAa an the QFPs with our FAINTECH.

This is just another service of Trelec  that we offer to ensure our customers’ satisfaction.