Trelec. Bilbao Technology Center

Our Capabilities for Printed Circuit Board Assembly

Trelec offers the latest technical capabilities to meet all the requirements for any circuit board assembly project. Whether we produce your product with BGA, Micro-BGA, Surface Mount or Through-Hole Technology, Trelec works closely with the customer to ensure that you will be 100% satisfied.

We specialize in new product introduction for volume production. Trelec´s technical capabilities include multiple, linked continuous flow production lines.

Our Capacity from creating Prototypes to Large Production Runs

Our 1,000 m² static-controlled production facility offers the latest technologies to deliver assembly of mid- to high-complexity printed circuit boards on time, including prototype and production quantities.